Core SMT/PCBA process (printing/stencil) digitalization

Vayo Stencil
Cut stencil prep time by up to 90%

For process engineers: Faster prep, automated review, and no more back-and-forth with vendors
For factory managers: Capture what your team knows, onboard faster, and standardize every plant
Request a demo Blog Series — Launching Soon
90%+
Less engineering effort
0%
Aperture Omission Rate
100%
Know-how captured
Stencil Printing is the Core SMT Process Screen Printer Printing / Stencil Core Step SPI Placement Reflow AOI THT Wave Test Over 70% of PCBA defects start at the printing step While printers, placement and AOI improved, printing became the weakest link One global EMS now traces over 95% of its defects to printing
01 / Industry Challenges

Manual stencil prep is costing you time and quality

EEngineers · Productivity Trap

Manual, repetitive, and impossible to fully check

Generic CAM tools were never designed for stencil work. Every requirement you write by hand, every revision you explain, and every review you do by eye costs hours. One missed aperture stops the line and delays the shipment.

Requirements take hours to write

Tedious requirement prep

Writing stencil requirements by hand means screenshots, callouts and long notes for every odd-form part.

0.5–8 hrs/design·Labor-intensive

Endless vendor back-and-forth

Inefficient vendor communication

You spend days on calls and email explaining intent to vendor engineers — and the result still depends on who reads it.

1–3 day cycles·1–20 revisions

Manual review misses defects

Manual review

Reviewing thousands of pads by eye is exhausting. On dense boards you can only spot-check, so defects get through.

3–15% miss rate·0.5–6 hrs/review

CAM tools built for another job

Lack of specialized tools

CAM350 and GC were built for bare-board fabrication, not SMT apertures. You end up fighting the tool instead of doing the work.

Wrong tool·Complex / slow
MManagers · Experience Trap

Your process knowledge lives in people's heads

When a senior engineer leaves, their judgment goes with them. Teams redo work someone already solved. And every plant quietly drifts to its own version of the process.

Process Engineering Team Management
Process engineering team management
Global Factory Team Collaboration
Global factory team collaboration

Enterprise Knowledge

Nothing captures what your team actually knows.
Every departure drains expertise.

60%+ Attrition rate

Talent Pipeline

The skill bar is high, so hiring is hard.
And new engineers take years to reach full speed.

1–3 yrs Ramp-up time

Team Collaboration

Teams rebuild apertures instead of sharing them.
Lessons learned never travel.

5%+ Duplication rate

Inconsistent process, inconsistent quality

Results depend on who did the work.

Fatigue and attention change the result.

Every plant runs its own variation.

Local turnover compounds the drift.

Switching suppliers introduces drift.

Their staffing changes make it worse.
3%–8% Variability cost: reorders, line stops, rework, recalls
02 / The Solution

Purpose-built tools, plus a library your whole team shares

Tools built specifically for stencil work, backed by one digital library every site draws from.

Engineers Process Owners

Less engineering time. Fewer reorders.

Automated requirements

Reuse requirements automatically and build complex apertures from a menu. No vendor calls.

Automated aperture review

Screen every aperture against your own rules and get alerted the moment something fails.

Built-in calculators

PIP fill-rate math, step-stencil generation and thermal-expansion compensation, all built in.

Enterprise Digital Process Library — one process knowledge base and engineering power tool
Managers Leadership

Consistent output everywhere. Teams that improve together.

Capture what your team knows

Turn unwritten experience into a managed library with versioning and role-based access.

One source of truth

Every plant works from the same library. Publish an update once and it is live everywhere.

Reuse across every project

Stop rebuilding apertures that already exist. Adopt proven practice and cut rework.

03 / Core Capabilities

Automated review that catches every defect

Replace manual inspection with automated screening, so nothing slips through and rework drops.

Manual review to digital screening
Digital screening
Automated screening cuts review time 80–95%, freeing engineers to work on process improvement instead of inspection.
Enterprise proof
60+ rule coverage
More than 60 configurable rules cover the stencil defects that matter. Coverage rises over 300% and quality incidents fall more than 50%.
Engineer benefit
Instant locate and fix
Every issue flags immediately and points to its exact location. Rework drops over 80% and the prep cycle shortens by half.
Process consistency challenge
Stop process drift
Different experience levels produce different results, and practices drift between plants and shifts.
Variance report
Variance reports and alerts
Diff any design against your enterprise standard or the previous revision.
03 / Core Capabilities

Stop rewriting requirements. Reuse them instead.

Define an aperture once and reuse it forever. No digging through old files and no relying on memory.

One-click reuse from the shared library

Engineers stop writing requirements by hand and start producing finished apertures. New boards pull from a library built from your own production history and unified team standards.

✓Shared across teams
✓Anyone can reuse it instantly
✓Consistent across every plant
✓50% faster stencil prep
Automatic reuse
03 / Core Capabilities

Odd-form part? Pick it from a menu.

Choose an aperture from a menu, adjust a few parameters, and you are done. Nothing to write, nothing to explain, nothing lost in translation.

Menu-based aperture creation

Build new package apertures in one click

Build complex apertures yourself instead of describing them over email. What you see is exactly what gets manufactured.

✓30+ ready-to-use templates
✓Adjustable parameters that adapt automatically
✓Zero vendor back-and-forth
✓WYSIWYG — no callouts, no write-ups
03 / Core Capabilities

Built-in tools for the tough cases

Specialized utilities for the edge cases that slow SMT process engineers down.

PIP fill-rate calculator

PIP fill-rate calculation

Live fill-rate results you can tune. No spreadsheets.

Step and special apertures

Specialized aperture creation

Step stencils, thermal expansion, and thermal or shared pads.

Works with your CAD stack

Data source compatibility

Imports 20+ ECAD formats and Gerber RS-274-D/X.

Precision measurement tools

CAM tooling

Fast, precise measurement built specifically for SMT process work.

Convert your history into assets

Batch conversion

Batch-convert past apertures into a reusable library automatically.

Iteration history and lookup

Iteration and lookup

Track every parameter change and review past iterations before trying new materials.

Fabrication-ready drawings

Drawing output

Export standard drawings as Gerber, DXF, EMF or PDF.

Bonus: SPI programming

SPI programming extension

Pull step size and position, and carry over pin numbers automatically.

03 / Core Capabilities

Full design function available, largely automated

Vayo Stencil transforms how you prepare stencils — requirements drafting, review and team collaboration. It also covers the complete stencil design.

Auto-reuse
Your standard library
Your proven practice

Create complex
Package apertures
In seconds

Step Stencil Creation

(Library-matched, auto-generated)

Step stencil creation

Pin-in-Paste (PIP)

(Auto fill-rate calculation)

Pin-in-Paste

Auto Clearance

(Solder-mask openings, holes, board edge, conveyor edge, components)

Auto clearance

Special Pad Handling

(Thermal pads, shared pads, test points, exposed copper vias)

Special pad handling

Rapid Panelization

Rapid panelization

Aperture history and traceability

Aperture history
04 / Management Outcomes

One standard across every plant. Worldwide Consistency

Vayo Stencil is more than an engineering tool. It gives managers one standard every plant can be measured against.

Build your core process platform

Capture know-how. Align every plant. Remove variation.

Process Engineering Team
Engineers 1–2 yrs
Engineers 3–5 yrs
Engineers 5–30 yrs
Process Iteration
Continuous Improvement
Production Quality Data
Feedback Loop

Enterprise / GroupDigital Process Library

ENTERPRISE KNOWLEDGEBASE
Unified Multi-Supplier Standard
Supplier A
Supplier B
Supplier C
USA
Mexico
China
Vietnam
Germany
Romania
Global Factory Teams
No more knowledge drain
New hires ramp instantly
Avoid human variability
Global process alignment
Management challenge → what changes
Knowledge never gets written down→From spreadsheets to one shared library
Turnover drains expertise→Knowledge lives in the library, not in heads
Skill bar too high to hire→Lower the bar for new engineers
New hires take too long→New hires reuse the team's work on day one
Same apertures rebuilt every project→Everyone starts from what already exists
Lessons never stick→Versioned history synced everywhere
Every engineer does it differently→One library, one process standard
Plants drift apart over time→One library keeps every site aligned
Each supplier runs their own way→Your standard, wherever boards are built
Reworks disrupt production→Reuse proven apertures, cut rework

Know-How Capture

Inheritance rate100%
Process standardizationFully unified
Knowledge drainEliminated

Quality Assurance

Omission rate~0%
Quality incidents down>50%
Consistency lift95%+

Efficiency Gains

Review time cut80–95%
Stencil cycle cut70–90%
New-hire ramp-up3–6 mo

Cost Reduction

Stencil rework down>80%
Trial runs cut>50%
Communication cost–90%
05 / Outsourced Manufacturing Empowerment

Make every EMS partner build to your standard

Define your printing standard once and push it to every contract manufacturer. Instead of each partner improvising its own apertures, they build to yours — and you can audit every one of them.

OEM Enterprise
Process Standard Owner
Smart Audit
Standard Process Library
STANDARD PROCESS LIBRARY
Stencil Process Standardization
Outsource Enablement Improvement Suggestions
A
EMS Site A
PCBA Contract Manufacturing
B
EMS Site B
PCBA Contract Manufacturing
C
EMS Site C
PCBA Contract Manufacturing

Blog Series: PCBA Core Process Digitalization — Launching Soon

Stencil printing is the core SMT process and defines PCBA manufacturing quality. Across industry challenges, the solution, core capabilities and customer stories, we unpack how digital transformation reshapes traditional process engineering — breaking the engineer's productivity trap and the manager's know-how transfer gap.

Coming Soon
CAM350 and GC serve bare-board fabrication. Vayo Stencil is built for the SMT stencil workflow: reusing your own production history, odd-form and complex-package apertures, step stencils, pin-in-paste, large BGA warpage, via clearance and more.
A board carries thousands of pads, sometimes tens of thousands. Checking each one by eye is exhausting and unreliable. Vayo Stencil screens every aperture against configurable digital rules and flags anything that fails, replacing visual inspection with a repeatable check you can trust.
Existing parts reuse apertures your team already approved, straight from the shared library — no recall, no searching old files. For a package nobody has built before, menu-driven templates create it directly. Because the output is a finished aperture rather than a written description, the back-and-forth with your vendor disappears.
No. Keep routine apertures with your stencil vendor and take back the work that actually hurts: odd-form packages, vendor communication and manual review. Those are the steps where quality and schedule risk concentrate, and the rest can stay outsourced.
Engineers get faster in their daily work. Management gets a library every plant shares, so experience stops leaving with individuals and quality stays consistent across sites. It also shortens hiring and onboarding, because new engineers start from the team's proven standard instead of learning it the hard way.
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