Have you ever seen 3D DFM/DFA/DFX solution for PCB/PCBA? Time to transform and upgrade to high level capability!
For many years, there are only 2D PCB/PCBA DFM software available. With couple of years efforts, Vayo has upgraded its PCB/PCBA DFM/DFA software from 2D solution to 3D solution, and won innovation award from IPC on APEX 2019 at San Diego, CA, USA.
This innovative 3D DFM/DFA software solution (https://www.vayoinfo.com/en/design-for-manufacturing/) allows you to better understand your PCBA products in virtualized 3D environment; with 1,500+ checking rules, you could predict design omissions, prototyping assembly difficulties, mass production issues and product reliability risks.
If you are an EMS/CEM player, you could not only capture manufacturability issues, but also demonstrate high level DFM/DFA capability to your clients.
“Vayo tool has been extremely useful for us in identifying assembly issues much ahead of the actual assembly process. This has drastically reduced holdups in the production line, increasing our productivity.” said Atar Mittal, General manager from Sierra Circuits.
“We are impressed by the high level 3D DFM/DFA capability. It does a great job identifying assembly issues that can easily be captured in 3D DFA/DFM reports. Customer feedback with this unique 3D DFA/DFM capability has been overwhelmingly positive.” said Mukesh Vasani, CEO from Aimtron Corporation.
Build up advanced DFM/DFA capability with 3D solution
Ease the understanding of assembly risk with unique 3D report
Detect sold joint reliability risk, increase product reliability
Detect manufacturability defects, increase 1st pass yield, reduce build cost
Detect assembly block, minimize the prototyping problems
Reduce design cycle, accelerate product launch
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