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Leverage PCB/PCBA DFM/DFA Capability with High Level 3D Solution

Time:2022-01-04Views:181

What are the two most important areas determining PCBA quality? DFM/DFA/DFX review and stencil aperture creation. DFM/DFA/DFX review is the area where we could find out quality risks before the design fix, stencil aperture creation is the last chance we could control solder joints quality upon design fix.

We’ve talked about know-how digitalization transformation to stencil aperture creation (core SMT process step), and we’d like to talk about high-level DFM/DFA/DFX solutions for PCB/PCBA this time.

You may still use the 2D DFM/DFA solution now, time to transform and upgrade your capability with a high-level 3D DFM/DFA/DFX solution!

Vayo’s 3D DFM/DFA/DFX solution, an IPC innovation awarded product, allows you to simulate a finished assembled board (PCBA), and better understand & communicate the impact of DFM/DFA/DFX violations in a virtualized PCBA environment.

The flexible checking rules edit function allows you to easily transfer your know-how of PCB design, fabrication & assembly to a digitalized knowledgebase for best practice enforcement & continuous improvement purposes.

1,500+ existing checks with 50 checks increasing per year is the commitment from the Vayo team, a technology-driven company with 16+ years of dedication to intelligent NPI software for the SMT industry.

“Vayo tool has been extremely useful for us in identifying assembly issues much ahead of the actual assembly process,” said Atar Mittal, General manager from Sierra Circuits. “We are impressed by the high-level 3D DFM/DFA capability. Customer feedback with this unique 3D DFA/DFM capability has been overwhelmingly positive,” said Mukesh Vasani, CEO of Aimtron Corporation.

Join any session below: 

American session: Thur, 6 January, 9 AM San Francisco

Europe & Asia session: Friday, 7 January, 9 AM Munich / 1:30 PM New Delhi

Reach us via business@vayoinfo.com or visit PCB/PCBA NPI software solutions.

Previous: Webinar Invitation: Automate SMT/Placement Programming to Accelerate NPI Next: Webinar: High Level DFM/DFA Capability (PCB/PCBA) Buildup/Upgrade with 3D Solution
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